KEY ACTIVITY
2.1 Enclosure Design

Updated 06/2025
Short Description
The enclosure design is fundamental to the module's integrity and protection. Designers must carefully select materials (like aluminum, steel, composites, or plastics) by balancing requirements for strength, weight, thermal conductivity, cost, and environmental sealing. A critical activity is defining the necessary IP rating (Ingress Protection) to shield internal components from dust and moisture. The design must also incorporate features for electrical insulation, safe lifting and handling, robust mounting points, and seamless integration with thermal management components. Effective sealing strategies, using gaskets, adhesives, or welding, are paramount to ensure long-term durability. Designers utilize CAD software and FEA (Finite Element Analysis) to simulate structural performance and optimize the design before prototyping.
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